01 / PROCESS
Standardised development
Standardisation of design and development processes.
CONNECT Semiconductor
Connecting chips.
Enabling what’s next.
Core technology designed to remove bottlenecks in advanced packaging—built on research, industrial partnerships and hardware delivery.
Advanced packaging · Glass substrates · Scalable systems
Overview
Addressing the bottlenecks in advanced packaging.
CONNECT Semiconductor has core technology which removes the bottlenecks in Advanced Packaging.
Image courtesy of PhotonicLeap
Technology
From core know-how to partner-ready systems.
Our approach combines process standardisation, intellectual property and materials expertise with systems designed for partners to use today.
02 / IP & KNOW-HOW
Key IP and know-how
Leveraging key intellectual property and accumulated expertise.
03 / MATERIALS
Glass substrates
Using glass as a key substrate in advanced packaging.
04 / SCALE
Scalable systems
Building and scaling systems that partners can use today.
The team
Built on experience.
Focused on delivery.
A heritage of research, partnerships and hardware delivery.
The CONNECT Semiconductor team knows the challenges and pain points of advanced packaging.
Our work is built on a heritage of decades of state-of-the-art research, industrial partnerships and hardware delivery.
The team consists of industry veterans who have built and delivered electronic, optical and medical products.
DecadesResearch heritage
IndustryPartnership experience
HardwareProduct delivery
Markets
Advanced packaging for high-value markets.
Our presentation identifies rapidly growing, high-value markets with key challenges that CONNECT’s technology can address.
Artificial intelligence
AI compute and packaging
Communications
Connected systems
Space & defence
Strategic applications
Quantum
Emerging technologies
Biomedical
Electronic and optical products
Strategic and high-margin focusSupporting EU sovereignty in key markets.
$4Bn → $14BnMarket growth figures shown in the Sept 2026 presentation (2026–2031); validate before publication.
Connect with us
Let’s move advanced packaging forward.
For partnership, technology and business enquiries.
Email: william.henry@tyndall.iePhone: +353 86 8077081